This stirs the doubts I have about the rumors regarding the timeline of the NSW2 SoC.
Chip tape-out is a step in the
manufacturing process. If you don’t intend to to start cranking out silicon you have nothing to gain, only loose, by moving to tape-out. So why, at Gamescom a year later, would they only have hardware ”representative of” the final performance? Not only should they have SoCs by then, they would have had time for a respin as well if need be. And yet they didn’t have even a test system capable of running at final specs?
It doesn’t make sense.
The easiest explanation is that either rumour is simply wrong. There are othe possible scenarios.
(Surrounding time data is the Orin nano which was out in September 2022 (and tape out long before), and Nvidia Ada series of GPUs, also launched in September 2022. Since these were done in parallell, you would assume that Nintendo and Nvidia could have agreed on SoC configuration and functional blocks and have the SoC ready for manufacture in roughly the same timeframe. And they still didn’t have even samples running at final specs early fall 2023?)
If you can have physical chips, you obviously want them! It’s both prudent for testing (even though it was likely assembled from existing verified functional blocks), and for prototyping.
I can’t make sense of it.
Regarding process node, if Goodtwin has good memory he may recall that I back in 2019 at Beyond3D felt that if Nintendo went with a 128-bit memory interface, they would have to move to 5nm to be able to exploit it within a realistic power envelope. Thraktor did a more thorough job than my napkin math but drew the same conclusion. I’m really curious to see the eventual result, and if need be contribute to a TechInsights investigation.
(For the less tech geeky, by this time there is no doubt however that the final silicon fulfills Nintendos required checkboxes regardless of node choice. They and Nvidia have had all the time in the world to ensure that’s the case.)